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Solder Paste Flux | High Temperature Lead-Free | Sn99Ag0.3Cu0.7, 217℃ Melting Point
This solder paste flux is for electronics repair and assembly. It's a lead-free option, good for projects needing a higher melting point. The paste contains Sn99Ag0.3Cu0.7 alloy, suitable for various ...
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Questions about this product
- What are the temperature limits and reflow requirements for this lead-free solder paste?
- This solder paste melts at 217 °C. You need to hit a peak reflow temperature between 235 °C and 245 °C. Keep the temperature above liquidus for 30 to 90 seconds to get a solid connection.
- How should I store this solder paste, and how long will it last?
- Store this paste in your refrigerator between 0 °C and 10 °C to keep it fresh. Under these cold conditions, the solder paste has a shelf life of six months. Once you apply it, you have a stencil life of eight hours at room temperature.
- What kind of electronics projects is this Sn99Ag0.3Cu0.7 paste designed for?
- This SAC307 lead-free paste is ideal for surface mount technology (SMT) and general electronics repair. The Type 3 particle size works well for standard stencil printing on circuit boards. Because it uses a no-clean flux, you do not have to wash off the non-corrosive residue after soldering.
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