Professional-Grade Sn99Ag0.3Cu0.7 Solder Paste | High-Temp Precision for Micro-Soldering & PCB Repair

Achieve precise, reliable repairs with this lead-free high-temperature solder paste Sn99 Ag0.3 Cu0.7. Formulated with a 99% tin, 0.3% silver, and 0.7% copper alloy, it offers superior thermal fatigue resistance and joint strength, with a melting point of approximately 217-227°C for durable connections in demanding applications. Features and Benefits - Sn99 Ag0.3 Cu0.7 Alloy - Provides excellent joint strength and thermal fatigue resistance, outperforming basic lead-free formulas for long-term reliability. - High-Temperature Formulation - With a melting point of 217-227°C, it maintains integrity in high-heat environments common in electronics repair and rework. - Needle Tube Dispenser - Allows for pinpoint accuracy and controlled application, minimizing waste and preventing solder bridges on fine-pitch components. - Lead-Free and RoHS Compliant - Safe for use in commercial electronics repair and environmentally conscious workshops, meeting modern regulatory standards. - Fine Particle Paste - Ensures smooth dispensing and excellent reflow characteristics for consistent, void-free solder joints. Applications - Mobile Phone USB Socket Repair - Ideal for reattaching small, multi-pin connectors and ports that require precise paste application and strong bonds. - LED Soldering and Reflow - Perfect for attaching LED components to boards or heat sinks where thermal management is critical. - General SMD Rework - Excellent for reballing BGAs, replacing ICs, and other surface-mount device repairs requiring a reliable solder paste.