RMA-223 Solder Paste | 10cc Precision Flux for BGA, SMD & PCB Repair

Achieve precise, reliable solder joints with this 10cc flux soldering paste. Formulated with RMA223 (RMA-223) chemistry, this no-clean solder paste offers excellent wetting action and a stable working viscosity for consistent application, reducing bridging and solder ball defects in fine-pitch work. Features and Benefits - RMA223 (Rosin Mildly Activated) Flux Core - Provides strong oxide removal for clean, shiny solder joints without requiring post-soldering cleaning in most applications. - 10cc Syringe with Precision Needle Tip - Allows for controlled, pinpoint paste deposition essential for micro-soldering tasks like 0402 components or BGA underfill. - Medium Viscosity Paste Formulation - Stays in place on pads without slumping, ensuring proper component alignment during reflow while remaining easy to dispense. - No-Clean, Halide-Free Formula - Leaves minimal, non-conductive residue that is typically safe to leave on the board, saving time and reducing chemical use. - Sealed, Air-Tight Syringe - Protects paste from drying out and oxidation, ensuring long shelf life and consistent performance from first use to last. Applications - BGA and SMD Rework - Ideal for re-balling or replacing fine-pitch integrated circuits and surface-mount devices on PCBs. - PCB Prototyping and Repair - Perfect for manual stenciling or spot application during board assembly, debugging, and component-level repair. - LED Array and Chip Soldering - Excellent thermal profile and wetting characteristics make it suitable for soldering LED modules and drivers. - General Electronics Maintenance - A reliable, versatile paste for hobbyists and technicians performing upgrades or fixes on computers, game consoles, and other electronics. Note Store in a cool, dry place with the cap securely fastened to maintain optimal consistency and performance.