Desoldering Braid | Premium Copper Wick for PCB & BGA Rework | 1.0mm-3.5mm

Achieve precise, clean solder removal with this professional-grade desoldering braid. Our high-purity copper wire wick, available in six diameters from 1.0mm to 3.5mm, features a tight, uniform braid for maximum capillary action. This ensures fast, efficient solder absorption without damaging delicate PCB pads or components, making it an essential tool for electronics rework. Features and Benefits - High-Purity Copper Construction - Ensures excellent thermal conductivity and solder wettability for rapid, complete solder removal with minimal heat application. - Six Precise Diameters (1.0mm to 3.5mm) - Select the perfect width for the job, from fine-pitch SMD components to large through-hole pads, for controlled and targeted work. - Tight, Uniform Braid Weave - Maximizes surface area and capillary action to draw molten solder up into the wick quickly and cleanly, leaving a residue-free pad. - No-Clean Flux Coating - The light rosin flux core activates with heat to improve solder flow and wicking performance without leaving corrosive residues that require cleaning. - Flexible and Kink-Resistant - The braided design allows the wick to conform to board contours and components for easy access in tight spaces without breaking. Applications - PCB Rework and Repair - Safely remove excess solder, correct bridging, or extract faulty through-hole and surface-mount components from circuit boards. - BGA and SMD Rework - The fine 1.0mm and 1.5mm wicks are ideal for precision work on ball grid arrays and small surface-mount devices without collateral damage. - Prototyping and Salvage - Cleanly desolder components from donor boards for reuse in new projects, preserving valuable parts and maintaining pad integrity.