Compel Groupgroup

Soldering Paste | Sn63/183℃ Melting Point | Lead-Free for Mobile Phone IC Repair

Stock #:CMP-01615
SKU:WELD-00533
Soldering Paste | Sn63/183℃ Melting Point | Lead-Free for Mobile Phone IC Repair - Image 1
$19.99
Ships to United States · standard est. 10-20 business days
Free standard shipping on orders over $59 (under 2kg). Express available at checkout.

This Sn63 soldering paste is a lead-free option for electronics repair. It has an 183℃ melting point and comes in a 20-38µm particle size. Use it for various delicate soldering tasks, including mobile...

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Questions about this product

How should I store this soldering paste, and how long does it last?
Keep this paste refrigerated between 0 and 10 °C to maintain its quality and prevent it from drying out. When stored properly, it has a reliable shelf life of six months. Always let the paste reach room temperature before you start soldering.
Can I use this paste for micro-soldering on smartphones?
Yes, this paste is designed for delicate mobile phone IC and CPU repairs. Its fine 20-38µm particle size allows you to apply it precisely on small BGA and SMD components.
What are the temperature limits I need to watch out for when soldering?
This soldering paste melts at 183 °C, which helps protect your heat-sensitive components from damage. Your reflow profile should reach a peak temperature between 210 and 230 °C. Ensure you keep the temperature above the liquidus point for 30 to 90 seconds during the process.

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