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Solder Paste Sn63/Pb37 | 183°C Medium Temp | No-Clean for BGA Rework

Stock #:CMP-01642
SKU:WELD-00559
Solder Paste Sn63/Pb37 | 183°C Medium Temp | No-Clean for BGA Rework - Image 1
$17.99
Ships to United States · standard est. 10-20 business days
Free standard shipping on orders over $59 (under 2kg). Express available at checkout.

This solder paste provides a Sn63/Pb37 alloy for general electronics repair. Its 183°C melting point suits many common soldering tasks. The no-clean formula simplifies rework, removing the need for po...

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Questions about this product

How should I store this solder paste, and how long will it last?
Keep it refrigerated between 2°C and 10°C to get a full six-month shelf life. If you store it at room temperature, use it within one month. It is best to let it reach room temperature before opening to prevent moisture buildup.
What temperature settings do I need to use for reflow soldering?
This paste melts at 183°C, but you need a peak reflow temperature between 205°C and 220°C. Keep the temperature above the melting point for 30 to 90 seconds. Exceeding these limits can damage your components or ruin the solder joint.
What kind of electronics projects is this Sn63/Pb37 paste designed for?
It is ideal for SMT component assembly, BGA reballing, and repairing PCB traces. Its Type 3 powder and no-clean formula work perfectly for detailed rework where residue cleanup is difficult. Do not use it if your project requires lead-free materials.

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Solder Paste Sn63/Pb37 | 183°C Medium Temp | No-Clean for BGA Rework

Solder Paste Sn63/Pb37 | 183°C Medium Temp | No-Clean for BGA Rework

Price$17.99
Rating4.7
Sold900+
Stock In stock
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