Solder Paste Sn63/Pb37 | 183°C Medium Temp | No-Clean for BGA Rework

Name: Solder Paste Sn63/Pb37 | 183°C Medium Temp | No-Clean for BGA Rework
Brand: Compel Group
SKU: WELD-00559
Price: 27.99 GBP
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Solder Paste Sn63/Pb37 | 183°C Medium Temp | No-Clean for BGA Rework

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Questions about this product

How should I store this solder paste, and how long will it last?: Keep it refrigerated between 2°C and 10°C to get a full six-month shelf life. If you store it at room temperature, use it within one month. It is best to let it reach room temperature before opening to prevent moisture buildup.
What temperature settings do I need to use for reflow soldering?: This paste melts at 183°C, but you need a peak reflow temperature between 205°C and 220°C. Keep the temperature above the melting point for 30 to 90 seconds. Exceeding these limits can damage your components or ruin the solder joint.
What kind of electronics projects is this Sn63/Pb37 paste designed for?: It is ideal for SMT component assembly, BGA reballing, and repairing PCB traces. Its Type 3 powder and no-clean formula work perfectly for detailed rework where residue cleanup is difficult. Do not use it if your project requires lead-free materials.

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This solder paste provides a Sn63/Pb37 alloy for general electronics repair. Its 183°C melting point suits many common soldering tasks. The no-clean formula simplifies rework, removing the need for post-soldering residue cleanup. Features and Benefits - Sn63/Pb37 alloy - offers a common, effective solder composition - 183°C melting temperature - works for most standard electronic components - No-clean flux - saves time by eliminating post-solder cleaning steps - Medium temperature application - reduces heat stress on sensitive components Applications - Reballing BGA components - Repairing PCB traces and pads - SMT component assembly and rework

Alloy Composition: Sn63/Pb37. Melting Point: 183 °C. Flux Type: No-Clean. Application: BGA Rework. Temperature Rating: Medium. Product Form: Paste. Residue Type: Non-conductive. Cleaning Requirement: Not required. Metal Content: 88% by weight. Powder Size: Type 3 (25-45 µm). Viscosity: 700-900 kcps (Malcom @ 10 RPM, 25°C). Tack Time: >8 hours. Slump Test: Pass (0.2 mm). Solder Ball Test: Pass (Type 1). Halide Content: <0.05%. Shelf Life (Refrigerated): 6 months (2-10°C). Shelf Life (Room Temperature): 1 month (20-25°C). Recommended Stencil Life: 4-8 hours. Reflow Profile Peak Temperature: 205-220°C. Reflow Profile Time Above Liquidus: 30-90 seconds. Residue Reliability (SIR): Pass (J-STD-004). Copper Mirror Corrosion: Pass. Electromigration: Pass. Residue Color: Clear/Light Amber. Q: What is the primary application for this solder paste? A: This solder paste is specifically formulated for BGA (Ball Grid Array) rework processes. Its no-clean properties and medium temperature melting point are optimized for precision component repair and replacement.. Q: How should this solder paste be stored to maintain its quality? A: For optimal shelf life, this solder paste should be stored under refrigeration at temperatures between 2°C and 10°C. Before use, allow the paste to equilibrate to room temperature for several hours to prevent condensation and ensure proper flow.. Q: Is it necessary to clean the residue after using this solder paste? A: No, cleaning of the residue is not required. This solder paste features a no-clean flux formulation, meaning the post-reflow residue is non-corrosive and electrically safe to be left on the PCB assembly.. Q: Does this solder paste contain lead? A: Yes, this solder paste contains lead. The alloy composition is Sn63/Pb37, indicating 63% tin and 37% lead. This makes it suitable for applications where leaded solder is permissible or required.. Q: Can this solder paste be used for stencil printing? A: Yes, this solder paste is designed for stencil printing applications, particularly in rework scenarios. Its rheological properties are optimized to provide consistent print definition and volume deposition for fine-pitch components like BGAs..

Solder Paste Sn63/Pb37 | 183°C Medium Temp | No-Clean for BGA Rework

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