Solder Paste Sn63/Pb37 | 183°C Medium Temp | No-Clean for BGA Rework

This solder paste provides a Sn63/Pb37 alloy for general electronics repair. Its 183°C melting point suits many common soldering tasks. The no-clean formula simplifies rework, removing the need for po...
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Questions about this product
- How should I store this solder paste, and how long will it last?
- Keep it refrigerated between 2°C and 10°C to get a full six-month shelf life. If you store it at room temperature, use it within one month. It is best to let it reach room temperature before opening to prevent moisture buildup.
- What temperature settings do I need to use for reflow soldering?
- This paste melts at 183°C, but you need a peak reflow temperature between 205°C and 220°C. Keep the temperature above the melting point for 30 to 90 seconds. Exceeding these limits can damage your components or ruin the solder joint.
- What kind of electronics projects is this Sn63/Pb37 paste designed for?
- It is ideal for SMT component assembly, BGA reballing, and repairing PCB traces. Its Type 3 powder and no-clean formula work perfectly for detailed rework where residue cleanup is difficult. Do not use it if your project requires lead-free materials.
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