Solder Paste for BGA & SMD Repair | Sn63/Pb37 Alloy | 183°C Melting Point

Achieve reliable, high-strength solder joints with the MECHANIC 183℃ XGZ40 Solder Paste. This Sn63/Pb37 alloy paste features a low 183°C melting point for safe component rework and a tacky XGZ40 flux formulation that prevents component shifting during reflow, ensuring precise placement for BGA and SMD repair. Features and Benefits - Sn63/Pb37 Alloy Composition - Provides a reliable eutectic solder with excellent electrical conductivity and strong, predictable joint formation for durable repairs. - Low 183°C Melting Point - Allows for safer rework on sensitive PCBs and multi-layer boards by minimizing heat exposure to surrounding components. - XGZ40 No-Clean Flux Formulation - Offers strong tackiness to hold components in place during assembly and leaves minimal residue that typically does not require post-solder cleaning. - Fine Particle Solder Paste - Ensures smooth printing and consistent deposition through stencils for accurate solder application on fine-pitch ICs and small components. - Sealed Syringe Packaging - Maintains paste freshness, prevents drying, and allows for controlled, mess-free application directly onto work surfaces. Applications - Mobile Phone and BGA Repair - Ideal for reballing and reattaching CPU, GPU, and other BGA chips on smartphones and tablets where precision is critical. - SMD Component Rework - Perfect for hand-soldering or hot-air rework of surface-mount resistors, capacitors, and ICs on various electronic devices. - General Electronics Maintenance - A reliable choice for technicians and hobbyists performing repairs, prototyping, or small-scale assembly on circuit boards.