Achieve reliable, high-quality solder joints with this 10cc syringe of RMA223 flux paste. This no-clean, rosin-based formula features a 223 flux activity level, providing excellent wetting and oxidation removal for precise SMD and BGA work. Its medium viscosity ensures easy application without bridging or spreading, delivering professional results for demanding PCB repair and assembly. Features and Benefits
- RMA223 Rosin-Based Formula - Provides strong flux activity for superior oxidation removal and solder wetting, ensuring clean, reliable electrical connections on modern PCBs.
- No-Clean, Halide-Free Composition - Leaves minimal, non-corrosive residue that typically does not require post-soldering cleaning, saving time and reducing chemical use.
- Medium Viscosity Paste - Stays in place during application and reflow, preventing bridging between fine-pitch components while remaining easy to dispense from the syringe.
- 10cc Precision Syringe - Offers controlled, pinpoint application directly to pads or components, minimizing waste and allowing for work on the smallest chip components.
- Wide Reflow Temperature Compatibility - Works effectively with common lead-free and leaded solder alloys, making it a versatile choice for various projects and specifications. Applications
- BGA and SMD Rework - Essential for reballing or replacing fine-pitch Ball Grid Array and Surface Mount Devices, where precise flux application is critical.
- PCB Repair and Rework - Ideal for repairing damaged traces, replacing components, or assembling prototype boards, especially in tight spaces.
- Mobile Device and Consumer Electronics Repair - Perfect for micro-soldering tasks on smartphones, tablets, and laptops, where reliability is paramount.
- LED Assembly and Hobbyist Projects - Excellent for general electronics work, from assembling LED strips to building custom circuits, providing professional-grade performance. Note
Store in a cool, dry place with the cap tightly sealed to prevent the paste from drying out.
Substrate Compatibility: PCB. Application: Electronics Assembly and Repair. Compatible Technologies: SMD, BGA, PGA, LED. Composition: RMA-223 Solder Paste. Container Volume: 10 cc. Flux Classification: RMA223. Flux Type: RMA (Rosin Mildly Activated). Form: Grease/Paste. Product Type: Solder Paste. Particle Size: Type 3 or 4 (25-45 μm or 20-38 μm) for fine-pitch work. Composition: Solder alloy particles suspended in RMA flux vehicle. Compatibility: Designed for computer chips, phone components, LED assemblies. Storage Temperature: Recommended 2°C to 10°C (refrigerated). Working Temperature: 200°C to 250°C (for SnPb alloy reflow). Container Type: Syringe or jar (inferred from paste format). Flux Activity Level: Mildly Activated (RMA). Flux Type: RMA223 (Rosin Mildly Activated, Type 223). Halide Content: Typically ≤ 0.05% (inferred for low-residue RMA). Metal Content: Typically 88-90% by weight (inferred for RMA223 paste). Net Quantity: 10 cubic centimeters (cc). Primary Application: Surface Mount Device (SMD) and Ball Grid Array (BGA) rework. Product Type: Rosin Mildly Activated (RMA) Solder Paste. Residue Characteristics: Low-residue, potentially non-corrosive. Secondary Application: Pin Grid Array (PGA) and general PCB repair. Shelf Life: Typically 6 months at room temperature, 12 months refrigerated. Solder Alloy: Tin-Lead (SnPb) based (inferred from RMA223 standard). Viscosity: Thixotropic paste suitable for syringe dispensing. Q: What are the specifications of this 10cc RMA-223 solder paste? A: This product is a 10cc (cubic centimeter) syringe of RMA-223 type solder paste. RMA-223 is a no-clean, rosin-based flux that is ideal for precision soldering tasks on sensitive electronics.. Q: Is this RMA-223 soldering paste durable and reliable for professional use? A: Yes, RMA-223 flux is a widely trusted industry-standard formula known for its reliability. It provides excellent wetting action, reduces oxidation, and leaves minimal residue, making it suitable for both professional PCB repair and serious DIY projects.. Q: Can this solder paste be used for repairing phone motherboards and BGA chips? A: Absolutely. This RMA-223 solder paste is specifically formulated for delicate electronics work. It is perfect for reballing or reflowing BGA, SMD, and PGA components on phone logic boards, computer chips, LED arrays, and other complex PCBs.. Q: Does this product come with any warranty or guarantee? A: Product guarantees are typically handled by the seller. We recommend reviewing the seller's specific policy for this RMA-223 solder paste at the point of purchase for details on satisfaction guarantees or replacements.. Q: Is this 10cc flux syringe a good value compared to other options? A: Yes, this offers excellent value for DIY enthusiasts and professionals seeking quality without premium brand pricing. The 10cc size is practical for numerous repairs, and the RMA-223 formula delivers reliable performance for regular use on SMD and BGA components..