
Prototyping & Development
2 products available
Looking for reliable prototyping and development boards to validate your circuit designs? Compel supplies high-grade prototype PCBs and universal boards engineered for hardware verification, R&D testing, and pre-production runs. We stock professional-grade FR-4 fiberglass boards designed to withstand repeated soldering and thermal stress during component development.
Our range covers standard double-sided layouts with industry-standard 2.54 mm hole pitch and 1.0 mm hole diameters to fit standard ICs and passive components. Engineering departments and electronics manufacturers choose Compel because we provide consistent board thicknesses, reliable 1 oz copper weights, and multi-size kits that keep your laboratory stocked. Get your systems running quickly with components that match your exact testing tolerances.
Industrial prototyping requires materials that resist warping under thermal load. Standard paper-based boards degrade quickly, which is why professional laboratories specify FR-4 fiberglass. This material provides the necessary mechanical strength and electrical isolation for high-frequency testing.
Board thickness also dictates how well the prototype integrates with physical enclosures. A standard 1.6 mm thickness prevents flexing when inserting heavy components or connectors.
Selecting the right dimensions prevents unnecessary cutting and dust exposure in the lab. Compel stocks standardized sizes ranging from compact 2x8 cm strips up to larger 7x9 cm universal boards. Having assortments of various dimensions on hand allows engineers to choose the exact footprint needed for their prototype housing.
Double-sided copper layers allow for flexible routing on both top and bottom surfaces, which simplifies complex circuit paths in tight spaces.
Standard electronic components rely on precise spacing to fit without lead bending. For breadboard-compatible testing, a 2.54 mm (0.1 inch) hole pitch is the industry standard. This spacing matches common dual in-line package (DIP) ICs, pin headers, and discrete passives.
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